MA001015226_15 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSC0904NSI
MA#
MA001015226
Package
PG-TDSON-8-6
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
silicon
iron
phosphorus
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
iron
phosphorus
copper
iron
phosphorus
copper
Issued
28. July 2015
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
Weight*
118.04 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.285
0.24
0.24
2410
2410
0.038
0.03
320
0.011
0.01
96
37.762 31.99 32.03 319898 320314
0.047
0.04
0.04
394
394
0.088
0.07
748
6.268
5.31
53097
37.783 32.01 37.39 320080 373925
1.470
1.25
1.25 12451 12451
0.166
0.14
0.14
1402
1402
0.012
0.01
100
0.009
0.01
80
0.450
0.38
0.40
3812
3992
0.011
0.01
96
0.003
0.00
29
11.320
9.59
9.60 95898 96023
0.022
0.02
189
0.007
0.01
57
22.292 18.88 18.91 188843 189089
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com