MA000997840 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BGA 725L6 E6327
MA#
MA000997840
Package
PG-TSLP-6-2
Construction Element Material Group
Substances
chip
bumps
leadframe
encapsulation
leadfinish
plating
solder
*deviation
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
noble metal
noble metal
noble metal
non noble metal
< 10%
silicon
copper
nickel
carbon black
epoxy resin
silicondioxide
gold
silver
silver
tin
Issued
29. August 2013
CAS#
if applicable
7440-21-3
7440-50-8
7440-02-0
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
7440-22-4
7440-31-5
Weight*
0.78 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.214
27.44 27.44 274386 274386
0.033
4.27
4.27 42714 42714
0.173
22.20 22.20 222000 222000
0.002
0.21
2100
0.048
6.09
60910
0.279
35.70 42.00 357060 420070
0.009
1.19
1.19 11862 11862
0.015
1.94
1.94 19371 19371
0.000
0.02
220
0.007
0.94
0.96
9377
9597
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com