MA000949834 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSS308PE H6327
MA#
MA000949834
Package
PG-SOT23-3-5
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
*deviation
non noble metal
noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
tin
gold
silicon
chromium
silicon
titanium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
Issued
19. December 2014
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Weight*
9.42 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.004
0.05
468
0.017
0.18
1816
0.261
2.77
3.00 27699 29983
0.009
0.10
959
0.001
0.01
64
0.003
0.03
320
3.000
31.85 31.99 318467 319810
0.076
0.81
0.81
8063
8063
0.056
0.60
5961
1.207
12.82
128155
4.352
46.17 59.59 461956 596072
0.150
1.59
1.59 15883 15883
0.284
3.02
3.02 30189 30189
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com