MA000887544 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSB013NE2LXI
MA#
MA000887544
Package
MG-WDSON-2-8
Construction Element Material Group
Substances
chip
leadframe
leadfinish
plating
glue
solder
passivation
*deviation
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
plastics
noble metal
non noble metal
noble metal
non noble metal
plastics
< 10%
silicon
copper
nickel
silver
nickel
epoxy resin
silver
copper
silver
tin
epoxy resin
Issued
19. November 2015
CAS#
if applicable
7440-21-3
7440-50-8
7440-02-0
7440-22-4
7440-02-0
-
7440-22-4
7440-50-8
7440-22-4
7440-31-5
-
Weight*
83.36 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
3.882
4.66
4.66 46575 46575
74.415 89.29 89.29 892741 892741
0.211
0.25
2534
0.840
1.01
1.26 10077 12611
0.211
0.25
0.25
2534
2534
0.178
0.21
2138
1.095
1.31
1.52 13136 15274
0.011
0.01
132
0.066
0.08
790
2.119
2.54
2.63 25416 26338
0.327
0.39
0.39
3927
3927
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com