MA000809452 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name IDD08SG60C
MA#
MA000809452
Package
PG-TO252-3-311
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
*deviation
noble metal
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
< 10%
gold
tin
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
Issued
29. August 2013
CAS#
if applicable
7440-57-5
7440-31-5
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
Weight*
312.11 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.113
0.04
361
0.029
0.01
93
1.433
0.46
0.51
4591
5045
0.162
0.05
521
0.049
0.02
156
162.275 51.98 52.05 519934 520611
0.986
0.32
0.32
3158
3158
1.432
0.46
4589
25.066
8.03
80312
116.736 37.40 45.89 374024 458925
3.740
1.20
1.20 11983 11983
0.086
0.03
277
0.000
0.00
0.03
1
278
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com