MA000801578 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BFP 196W H6327
MA#
MA000801578
Package
PG-SOT343-4-1
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
*deviation
noble metal
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
gold
tin
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
Issued
29. August 2013
CAS#
if applicable
7440-57-5
7440-31-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Weight*
6.74 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.003
0.04
432
0.001
0.01
111
0.025
0.38
0.43
3763
4306
0.001
0.01
100
0.003
0.05
499
0.010
0.15
1497
3.347
49.68 49.89 496850 498946
0.011
0.17
0.17
1659
1659
0.031
0.46
4560
0.661
9.80
98047
2.381
35.34 45.60 353427 456034
0.199
2.96
2.96 29573 29573
0.064
0.95
0.95
9482
9482
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com