MA000505226 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BGA 728L7 E6327
MA#
MA000505226
Package
PG-TSLP-7-1
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
glue
*deviation
inorganic material
non noble metal
noble metal
inorganic material
organic material
plastics
inorganic material
noble metal
noble metal
plastics
noble metal
< 10%
silicon
nickel
gold
antimonytrioxide
carbon black
epoxy resin
silicondioxide
gold
gold
epoxy resin
silver
Issued
30. January 2015
CAS#
if applicable
7440-21-3
7440-02-0
7440-57-5
1309-64-4
1333-86-4
-
60676-86-0
7440-57-5
7440-57-5
-
7440-22-4
Weight*
1.62 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.147
9.12
9.12 91165 91165
0.329
20.34 20.34 203415 203415
0.043
2.69
2.69 26853 26853
0.000
0.03
294
0.010
0.59
5886
0.128
7.95
79455
0.813
50.27 58.84 502921 588556
0.032
1.96
1.96 19573 19573
0.032
1.96
1.96 19573 19573
0.016
1.02
10173
0.066
4.07
5.09 40692 50865
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com