MA000475628 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BGS 12AL7-4 E6327
MA#
MA000475628
Package
PG-TSLP-7-4
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
glue
*deviation
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
noble metal
noble metal
plastics
< 10%
silicon
nickel
gold
carbon black
epoxy resin
silicondioxide
gold
gold
acryl-epoxy resin
Issued
29. August 2013
CAS#
if applicable
7440-21-3
7440-02-0
7440-57-5
1333-86-4
-
60676-86-0
7440-57-5
7440-57-5
-
Weight*
3.99 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.158
3.95
3.95 39455 39455
1.532
38.37 38.37 383668 383668
0.057
1.43
1.43 14343 14343
0.021
0.52
5154
0.278
6.96
69586
1.760
44.06 51.54 440708 515448
0.080
2.01
2.01 20092 20092
0.080
2.01
2.01 20092 20092
0.028
0.69
0.69
6902
6902
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com