MA000303898 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BTM7811K
MA#
MA000303898
Package
PG-TO263-15-1
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
solder
*deviation
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
Issued
29. August 2013
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Weight*
3415.00 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
17.367
0.51
0.51
5086
5086
2.037
0.06
596
0.611
0.02
179
2034.173 59.55 59.63 595657 596433
4.425
0.13
0.13
1296
1296
19.682
0.58
5763
216.503 6.34
63398
1075.952 31.51 38.43 315067 384228
31.059
0.91
0.91
9095
9095
0.493
0.01
144
0.001
0.00
0.01
1
144
0.317
0.01
93
0.254
0.01
74
12.128
0.36
0.38
3551
3718
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com