MA000218825 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name TDA5251
MA#
MA000218825
Package
PG-TSSOP-38-1
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
glue
*deviation
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
silicon
nickel
iron
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
Issued
28. August 2013
CAS#
if applicable
7440-21-3
7440-02-0
7439-89-6
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Weight*
117.48 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
5.461
4.65
4.65 46481 46481
19.584 16.67
166702
27.045 23.02 39.69 230208 396910
0.900
0.77
0.77
7662
7662
0.178
0.15
1513
7.526
6.41
64062
51.556 43.88 50.44 438853 504428
2.173
1.85
1.85 18494 18494
1.464
1.25
1.25 12464 12464
0.319
0.27
2712
1.275
1.08
1.35 10849 13561
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com