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| IRFL4105PBF Datasheet, PDF (1/10 Pages) International Rectifier – HEXFET® Power MOSFET | |||
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ï· Surface Mount
ï· Advanced Process Technology
ï· Ultra Low On-Resistance
ï· Dynamic dv/dt Rating
ï· Fast Switching
ï· Fully Avalanche Rated
ï· Lead-Free
Description
Fifth Generation HEXFETs from International Rectifier utilize
advanced processing techniques to achieve extremely low on-
resistance per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that HEXFET
Power MOSFETs are well known for, provides the designer with
an extremely efficient and reliable device for use in a wide variety
of applications.
The SOT-223 package is designed for surface-mount using vapor
phase, infra red, or wave soldering techniques. Its unique
package design allows for easy automatic pick-and-place as with
other SOT or SOIC packages but has the added advantage of
improved thermal performance due to an enlarged tab for heat
sinking. Power dissipation of 1.0W is possible in a typical surface
mount application.
G
Gate
IRFL4105PbF
HEXFET® Power MOSFET
VDSS
RDS(on)
ID
55V
0.045ïï
3.7A
SOT-223
D
Drain
S
Source
Base Part Number
IRFL4105PbF
Package Type
SOT-223
Standard Pack
Form
Quantity
Tape and Reel
2500
Orderable Part Number
IRFL4105PbF
Absolute Maximum Ratings
Symbol
Parameter
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V ï
ID @ TA = 25°C
ID @ TA = 70°C
IDM
PD @TA = 25°C
Continuous Drain Current, VGS @ 10V ï
Continuous Drain Current, VGS @ 10V ï
Pulsed Drain Current ï
Maximum Power Dissipation (PCB Mount) ï
PD @TA = 25°C
Maximum Power Dissipation (PCB Mount) ï
Linear Derating Factor (PCB Mount) ï
VGS
EAS
IAR
EAR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally Limited) ï
Avalanche Current ï
Repetitive Avalanche Energy ï
Peak Diode Recovery dv/dt ï
TJ
TSTG
Operating Junction and
Storage Temperature Range
Max.
5.2
3.7
3.0
30
2.1
1.0
8.3
± 20
110
3.7
0.10
5.0
-55 to + 150
Units
A
W
mW/°C
V
mJ
A
mJ
V/ns
°C
Thermal Resistance
Symbol
Parameter
Rï±JA
Junction-to-Ambient (PCB Mount, steady state) ï
Rï±JA
Junction-to-Ambient (PCB Mount, steady state) ï
Typ.
90
50
Max.
120
60
Units
°C/W
1
2016-5-27
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