IGC70T120T6RL Datasheet, PDF (1/5 Pages) Infineon Technologies AG – IGBT4 Low Power Chip

IGC70T120T6RL
IGBT4 Low Power Chip
FEATURES:
• 1200V Trench + Field Stop technology
• low switching losses
• positive temperature coefficient
• easy paralleling
This chip is used for:
• low / medium power modules
Applications:
• low / medium power drives
C
G
E
Chip Type
V_CE
I_Cn
IGC70T120T6RL 1200V 75A
Die Size
9.12 x 7.71 mm²
Package
sawn on foil
MECHANICAL PARAMETER
Raster size
Emitter pad size (incl. gate pad)
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Pad metal
Backside metal
Die bond
Wire bond
Reject ink dot size
Recommended storage environment
9.12 x 7.71
7.61 x 6.24
1.31 x 0.81
mm ²
70.3 / 51.6
115
µm
150
mm
90
grd
200
Photoimide
3200 nm AlSiCu
Ni Ag –system
suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
Al, <500µm
∅ 0.65mm ; max 1.2mm
Store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by IN FINEON Technologies , AIM PMD D CID CLS , L7673C, Edition 1, 31.10.2007