BGA700L16 Datasheet, PDF (1/2 Pages) Infineon Technologies AG – Low Noise Amplifier for IEEE 802.11a/b/g/n

BGA700L16
Low Noise Amplifier for IEEE 802.11a/b/g/n
Product Brief
T h e B G A 7 0 0 L 1 6 is a Wireless LAN dual band Low Noise Amplifier.
The amplifier comprises a single stage amplifier for the 2.45 GHz band and a two-
stage amplifier to meet the requirements of the 4.9 to 5.95 GHz band. The complete
circuitry, including a temperature stabilization block, fits on one die and needs no
external matching elements.
One of the challenges of Wireless LAN application designers is to maximize network
coverage and data throughput. The receiver system noise figure determines
sensitivity, network coverage and data throughput.
The BGA700L16 uses a combination of Silicon Germanium Carbon epitaxy
proprietary process and a low ohmic on chip ground contact from Infineon
Technologies to deliver the word best-in class noise figure for wireless LAN systems.
The BGA700L16 ships as bare die or in a low profile Tiny Small Leadless Package
code-named TSLP-16. The package dimensions are 2.3 x 2.3 x 0.39 mm³.
Applications
■ 802.11a/b/g/n
Features
■ Input/output 50 W matched internally
■ SiGe:C process
■ Shut down mode
■ Temperature stabilization
Benefits
■ Extended coverage
■ Ultra-low noise figure
■ Small form factor
■ High level of integration
■ Low cost
TSLP-16 Package
2.3 x 2.3 x 0.39 mm³
www.infineon.com/smallsignaldiscretes
Small Signal Discretes