AUIRL7736M2 Datasheet, PDF (1/11 Pages) International Rectifier – DirectFETPower MOSFET

AUTOMOTIVE GRADE
AUIRL7736M2TR
 Logic Level
 Advanced Process Technology
 Optimized for Automotive Motor Drive, DC-DC and
other Heavy Load Applications
 Exceptionally Small Footprint and Low Profile
 High Power Density
 Low Parasitic Parameters
 Dual Sided Cooling
 175°C Operating Temperature
 Repetitive Avalanche Capability for Robustness and Reliability
 Lead free, RoHS and Halogen free
 Automotive Qualified *
Automotive DirectFET^® Power MOSFET 
V_(BR)DSS
R_DS(on) typ.
max.
I_{D (Silicon Limited)}
Q_{g (typical)}
40V
2.2m
3.0m
112A
52nC
S
S
D
G
S
S
D
Applicable DirectFET^® Outline and Substrate Outline 
M4
DirectFET^® ISOMETRIC
SB
SC
M2
M4
L4
L6
L8
Description
The AUIRL7736M2 combines the latest Automotive HEXFET® Power MOSFET Silicon technology with the advanced DirectFET^® packaging
technology to achieve exceptional performance in a package that has the footprint of an SO-8 or 5X6mm PQFN and only 0.7mm profile. The
DirectFET® package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or
convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET^®
package allows dual sided cooling to maximize thermal transfer in automotive power systems.
his HEXFET^® Power MOSFET is designed for applications where efficiency and power density are of value. The advanced DirectFET^® packaging
platform coupled with the latest silicon technology allows the AUIRL7736M2 to offer substantial system level savings and performance improvement
specifically in high frequency DC-DC, motor drive and other heavy load applications on ICE, HEV and EV platforms. The AUIRL7736M2 can be utilized
together with the AUIRL7732S2 as a sync/control MOSFET pair in a buck converter topology. This MOSFET utilizes the latest processing techniques
to achieve low on-resistance and low Qg per silicon area. Additional features of this MOSFET are 175°C operating junction temperature and high
repetitive peak current capability. These features combine to make this MOSFET a highly efficient, robust and reliable device for high current
automotive applications.
Base Part Number
Package Type
Standard Pack
Form
Quantity
Orderable Part Number
AUIRL7736M2
DirectFET Medium Can
Tape and Reel
4800
AUIRL7736M2TR
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
Max.
Units
V_DS
V_GS
I_D @ T_C = 25°C
I_D @ T_C = 100°C
I_D @ T_C = 25°C
I_D @ T_A= 25°C
I_DM
P_D @T_C = 25°C
P_D @T_A = 25°C
E_AS
E_AS (Tested)
I_AR
E_AR
T_P
T_J
T_STG
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V_GS @ 10V (Silicon Limited) 
Continuous Drain Current, V_GS @ 10V (Silicon Limited) 
Continuous Drain Current, V_GS @ 10V (Package Limited)
Continuous Drain Current, V_GS @ 10V (Silicon Limited) 
Pulsed Drain Current 
Power Dissipation 
Power Dissipation 
Single Pulse Avalanche Energy (Thermally Limited) 
Single Pulse Avalanche Energy 
Avalanche Current 
Repetitive Avalanche Energy 
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
40
±16
V
112
79
179
A
22
450
63
2.5
W
68
119
mJ
See Fig. 16, 17, 18a, 18b
A
mJ
260
-55 to + 175
°C
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
1
2015-10-29