AUIRF7739L2TR_15 Datasheet, PDF (1/11 Pages) Infineon Technologies AG – Automotive DirectFET Power MOSFET

AUTOMOTIVE GRADE
AUIRF7739L2TR
 Advanced Process Technology
 Optimized for Automotive Motor Drive, DC-DC and
other Heavy Load Applications
 Exceptionally Small Footprint and Low Profile
 High Power Density
 Low Parasitic Parameters
 Dual Sided Cooling
 175°C Operating Temperature
 Repetitive Avalanche Capability for Robustness and Reliability
 Lead free, RoHS and Halogen free
 Automotive Qualified *
Automotive DirectFET^® Power MOSFET 
V_(BR)DSS
R_DS(on) typ.
max.
I_{D (Silicon Limited)}
Q_{g (typical)}
40V
700µ
1000µ
270A
220nC
S
S
D
G
S
S
S
S
D
S
S
Applicable DirectFET^® Outline and Substrate Outline 
L8
DirectFET^® ISOMETRIC
SB
SC
M2
M4
L4
L6
L8
Description
The AUIRF7739L2TR combines the latest Automotive HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging to
achieve the lowest on-state resistance in a package that has the footprint of a DPak (TO-252AA) and only 0.7 mm profile. The DirectFET package is
compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering
techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual
sided cooling to maximize thermal transfer in automotive power systems.
This HEXFET® Power MOSFET is designed for applications where efficiency and power density are essential. The advanced DirectFET® packaging
platform coupled with the latest silicon technology allows the AUIRF7739L2TR to offer substantial system level savings and performance improvement
specifically in motor drive, high frequency DC-DC and other heavy load applications on ICE, HEV and EV platforms. This MOSFET utilizes the latest
processing techniques to achieve low on-resistance and low Qg per silicon area. Additional features of this MOSFET are 175°C operating junction
temperature and high repetitive peak current capability. These features combine to make this MOSFET a highly efficient, robust and reliable device for
high current automotive applications.
Base Part Number
Package Type
Standard Pack
Form
Quantity
Orderable Part Number
AUIRF7739L2
DirectFET Large Can
Tape and Reel
4000
AUIRF7739L2TR
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
V_DS
V_GS
I_D @ T_C = 25°C
I_D @ T_C = 100°C
I_D @ T_A = 25°C
I_D @ T_C = 25°C
I_DM
P_D @T_C = 25°C
P_D @T_A = 25°C
E_AS
E_{AS (tested)}
I_AR
E_AR
T_P
T_J
T_STG
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V_GS @ 10V (Silicon Limited) 
Continuous Drain Current, V_GS @ 10V (Silicon Limited) 
Continuous Drain Current, V_GS @ 10V (Silicon Limited) 
Continuous Drain Current, V_GS @ 10V (Package Limited)
Pulsed Drain Current 
Power Dissipation 
Power Dissipation 
Single Pulse Avalanche Energy (Thermally Limited) 
Single Pulse Avalanche Energy (Tested Value) 
Avalanche Current 
Repetitive Avalanche Energy 
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Max.
40
±20
270
190
46
375
1070
125
3.8
270
160
See Fig. 16, 17, 18a, 18b
270
-55 to + 175
Units
V
A
W
mJ
A
mJ
°C
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
1
2015-11-19