ISM82 Datasheet, PDF (2/2 Pages) ILSI America LLC – 3.2 mm x 5.0 mm Ceramic Package SMD Oscillator

3.2 mm x 5.0 mm Ceramic Package SMD Oscillator
Pb Free Solder Reflow Profile:
Typical Application:
ISM82 Series
*Units are backward compatible with 240º C reflow processes
Package Information:
MSL = N.A. (Package does not contain plastic; storage life is unlimited under normal room conditions.)
Termination = e4 (Au over Ni over W base metallization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications:
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking:
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
Proprietary and Confidential
This document contains proprietary information, and such information may not be disclosed to others for any purpose nor used for
manufacturing purpose without the written permission o ILSI America.
ILSI America Phone [phone] ● Fax [phone] ●email: [e-mail] ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 10/20/14_A3
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