IL3T Datasheet, PDF (2/2 Pages) ILSI America LLC – 2 Pad Ceramic Base SMD Crystal, 2.0 mm x 1.2 mm

2 Pad Ceramic Base SMD Crystal, 2.0 mm x 1.2 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
IL3T Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 2
Termination = e1 (Sn/Cu/Ag over Ni over Kovar base metal)
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: Frequency, Date Code
3000
8.0 ±0.2
4.0 ±0.1
3.5 ±0.05
9.0 ±0.3
60 / 80
180 / 250
PROPRIETARY AND CONFIDENTIAL
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY
PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America.
ILSI America Phone [phone] ● Fax [phone] ●email: e-mail.ilsiamerica@com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 04/05/15_B
Page 2 of 2