I589 Datasheet, PDF (2/3 Pages) ILSI America LLC – High precision GPS support

1.6 x 2.0 mm Ceramic Package TCXO / VCTCXO
Pb Free Solder Reflow Profile:
Units are backward compatible with +240ºC reflow processes
Circuit Configuration:
I589 / I789 Series
Ts max to T_L (Ramp-up Rate)
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
Ramp-up Tate (T_L to Tp
Time Maintained Above
Temperature (T_L)
Time (T_L)
Peak Temperature (Tp)
Time within 5ºC to Peak
Temperature (Tp)
Ramp-down Rate
Tune 25ºC to Peak
Temperature
Moisture Sensitivity Level (MSL)
3ºC / second max
150ºC
175ºC
200ºC
60 to180 seconds
3ºC / second max
217ºC
60 to 150 seconds
260ºC max for seconds
20 to 40 seconds
6ºC / second max
8 minute max
Level 1
Notes:
 It is recommended that a 0.01 µF bypass capacitor be connected between Vdd (Pin 4) and Ground (Pin 2) to minimize power supply noise.
 It is recommended that an external 0.01 µF AC-coupling capacitor be connected to output (Pin 3) of the device.
 For the TCXO (I598) Pin 1 should not be left floating but must be connected to ground.
Environmental Specifications:
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
ILSI America Phone [phone] ● Fax [phone] ●email: [e-mail] ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 02/10/16_A
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