HC49USM-BB0F18-20.000 Datasheet, PDF (2/2 Pages) ILSI America LLC – 2 Pad Metal Package, 4.7 mm x 13.3 mm

2 Pad Metal Package, 4.7 mm x 13.3 mm
Pb Free Solder Reflow Profile:
HC49USM Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N/A
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Frequency, Date Code
1000
24 +/-.3
12 +/-.2
11.5 +/-.2
25 +/-1.5
80/100
330
04/09
ILSI America Phone: [phone] • Fax: [phone]• e-mail: [e-mail] • www.ilsiamerica.com
Specifications subject to change without notice
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