ILE4276 Datasheet, PDF (3/6 Pages) IK Semicon Co., Ltd – Low consumption current

ILE4276
Table 2. Absolute Maximum Ratings
Symbol
Parameters
Min.
Max.
Unit
Т_J
Junction temperature
Т_stg
Storage temperature
V_I
Input voltage I
LE4276-5.0, ILE4276-8.5, ILE4276-10
-40*
150
o_C
-50
150
o_C
-42
45
V
ILE4276-AD (at U_Q < 4 V)
V_INH
Inhibit input voltage
I_GND
Ground pin current
V_Q
Output voltage
ILE4276-5.0, ILE4276-8.5,
-42**
45**
V
-
100
mA
V
-1,0**
40**
ILE4276-10, ILE4276-AD
V_VA
Adjustment input voltage
ILE4276-AD
-0,3**
10**
V
_________
* Ambient temperature is indicated.
** Voltage is not applied to input I
* Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those in-
dicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 3. Recommended Operation Rate
Symbol
Т_J
V_I
V_Q
V_VA
Parameter
Junction temperature
Input voltage
ILE4276-5.0
ILE4276-8.5
ILE4276-10
ILE4276-AD (при U_Q < 4 V)
Output voltage
ILE4276-5.0
ILE4276-8.5
ILE4276-10
ILE4276-AD
Adjustment input voltage
ILE4276-AD
Min.
Max.
Unit
-40*
150
o_C
V
5.7
40
9.34
40
10.9
40
4.5
40
V
4.8
5.2
8.16
8.84
9.6
10.4
2.4
20
2.4**
2.6**
V
Note:
Maximum power P_tot,W, dissipated by IC at ambient temperature T_A , is calculated by formula:
P_tot = (150 - T_A) / R_{th j-a} ,
(1)
150 – maximum permissible operating junction temperature, ^OC.
R_{th j-a} - thermal resistance junction ambient (for IC without heat sink), ^oC /W,
for ILE4276-AD, ILE4276-5.0, ILE4276-8.5, ILE4276-10 without heat sink R_{th ja} is equal 80 ^oC /W
for ILE4276-AD, ILE4276-5.0, ILE4276-8.5, ILE4276-10 ILE4275 without heat sink R_{th ja} is equal 65 ^oC /W
for IC with heat sink R_{th ja} is calculated by formula
R_{th j-a} = R_{th j-c} + R_{th c-a} ,
(2)
R_{th j-c} - thermal resistance junction case, ^oC /W. R_{th jc} = 4 ^oC/W.
Thermal resistance case-ambient R_{th c-a} is determined by heat sink design and is selected by IC custom-
er.
Application circuit and heat sink and ambient temperature have to provide junction temperature not more
T_J  150 ^OC.
_________
* Ambient temperature is indicated.
January 2011, Ver.01