DAC1408D650 Datasheet, PDF (6/96 Pages) NXP Semiconductors – Dual 14-bit DAC, up to 650 Msps, 2´ and 4´ interpolating with JESD204A interface

Integrated Device Technology
DAC1408D650
2, 4 or 8 interpolating DAC with JESD204A
Table 2.
Symbol
VIN_N0
VIN_P0
V_DDD(1V8)
VIN_P1
VIN_N1
VIN_N2
VIN_P2
V_DDD(1V8)
VIN_P3
VIN_N3
n.c.
n.c.
JTAG
GND
Pin description …continued
Pin Type^[1]
52 I
53 I
54 P
55 I
56 I
57 I
58 I
59 P
60 I
61 I
62 -
63 -
64 I
H^[2] G
Description
serial interface lane 0 negative input
serial interface lane 0 positive input
digital supply voltage 1.8 V
serial interface lane 1 positive input
serial interface lane 1 negative input
serial interface lane 2 negative input
serial interface lane 2 positive input
digital supply voltage 1.8 V
serial interface lane 3 positive input
serial interface lane 3 negative input
not connected
not connected
JTAG test mode select (must be grounded)
ground
[1] P: power supply; G: ground; I: input; O: output.
[2] H = heatsink (exposed die pad to be soldered to GND. A minimum of 81 thermal vias are required).
7. Limiting values
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
V_DDA(3V3)
V_DDA(1V8)
V_DDD
T_stg
T_amb
T_j
analog supply voltage (3.3 V)
analog supply voltage (1.8 V)
digital supply voltage
storage temperature
ambient temperature
junction temperature
8. Thermal characteristics
Min Max Unit
0.5 +4.6 V
0.5 +2.5 V
0.5 +2.5 V
55 +150 C
40 +85 C
40 +125 C
Table 4.
Symbol
R_th(j-a)
R_th(j-c)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to case
[1] Complies with JEDEC test board, in free air.
Conditions
Typ
[1] _18.7
[1] _6.7
Unit
K/W
K/W
DAC1408D650 6
Product data sheet
Rev. 06 — 2 July 2012
© IDT 2012. All rights reserved.
6 of 96