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ICS874003-04 Datasheet, PDF (5/15 Pages) Integrated Device Technology – PCI EXPRESS™ Jitter Attenuator
ICS874003-04 Data Sheet
PCI EXPRESS™ JITTER ATTENUATOR
Table 4C. Differential DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = 0°C to 70°C
Symbol Parameter
Test Conditions
Minimum
IIH
IIL
VPP
VCMR
Input High Current
CLK
nCLK
Input Low Current
CLK
nCLK
Peak-to-Peak Voltage; NOTE 1
Common Mode Input Voltage; NOTE 1, 2
VDD = VIN = 3.465V
VDD = VIN = 3.465V
VDD = 3.465V,
VIN = 0V
VDD = 3.465V,
VIN = 0V
-5
-150
0.15
GND + 0.5
NOTE 1: VIL should not be less than -0.3V.
NOTE 2: Common mode input voltage is defined as VIH.
Typical
Maximum
150
5
1.3
VDD – 0.85
Units
µA
µA
µA
µA
V
V
Table 4D. LVDS DC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = 0°C to 70°C
Symbol Parameter
Test Conditions
Minimum
VOD
∆VOD
VOS
∆VOS
Differential Output Voltage
VOD Magnitude Change
Offset Voltage
VOS Magnitude Change
275
1.20
Typical
375
1.35
Maximum
485
50
1.50
50
Units
mV
mV
V
mV
Table 5. AC Characteristics, VDD = VDDO = 3.3V ± 5%, TA = 0°C to 70°C
Symbol Parameter
Test Conditions
fMAX
tjit(cc)
Output Frequency
Cycle-to-Cycle Jitter; NOTE 1
tsk(o)
Output Skew; NOTE 1, 2
tsk(b)
Bank Skew; NOTE 1, 3
Bank A
tR / tF
odc
Output Rise/Fall Time
Output Duty Cycle
20% to 80%
Minimum
98
215
47
Typical
Maximum
320
35
135
50
550
53
Units
MHz
ps
ps
ps
ps
%
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium
has been reached under these conditions.
NOTE 1: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the differential cross
points.
NOTE 3: Defined as skew within a bank of outputs at the same voltage and with equal load conditions.
ICS874003AG-04 REVISION A NOVEMBER 4, 2009
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©2009 Integrated Device Technology, Inc.