ICS670-03 Datasheet, PDF (4/7 Pages) Integrated Circuit Systems – LOW PHASE NOISE, ZERO DELAY BUFFER AND MULTIPLIER

ICS670-03
LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
Parameter
Short Circuit Current
Internal Pull-up Resistor
Input Capacitance
Symbol
Conditions
I_OS Each output
R_PU OE, select pins
C_IN OE, select pins
Min.
Typ.
±50
200
5
Max.
Units
mA
kΩ
pF
AC Electrical Characteristics
VDD = 3.3V ±10%, Ambient Temperature -40 to +85° C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Clock Frequency
Output Clock Frequency
f_IN
See table on page 2
5
210 MHz
210 MHz
Output Rise Time
Output Fall Time
Output Clock Duty Cycle
Input to Output Skew
t_OR 0.8 to 2.0 V, no load
t_OF 2.0 to 0.8 V, no load
t_DC measured at VDD/2
Note 1
1.5 ns
1.5 ns
40
50 60
%
±100
ps
Maximum Absolute Jitter
short term
±45
ps
Maximum Jitter
one sigma
15
ps
Phase Noise, relative to
carrier, 125 MHz (x5)
100 Hz offset
1 kHz offset
-110
-122
dBc/Hz
dBc/Hz
10 kHz
-124
dBc/Hz
200 kHz
-117
dBc/Hz
Note 1: Rising edge of ICLK compared with rising edge of CLK2, with FBCLK connected to FBIN, and 15 pF load
on CLK2. See graph on page 5 for skew vs. frequency and loading.
Thermal Characteristics
Parameter
Symbol Conditions
Thermal Resistance Junction to
Ambient
θ_JA Still air
θ_JA 1 m/s air flow
θ_JA 3 m/s air flow
Thermal Resistance Junction to Case θ_JC
Min.
Typ.
120
115
105
58
Max.
Units
° C/W
° C/W
° C/W
° C/W
IDT™ / ICS™ LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER 4
ICS670-03
REV J 051310