F1150NBGI Datasheet, PDF(23/26 Page) Integrated Device Technology

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F1150NBGI Datasheet, PDF (23/26 Pages) Integrated Device Technology – RF to IF Dual Downconverting Mixer

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DATASHEET

RF to IF Dual Downconverting Mixer

PIN DESCRIPTIONS

1700 - 2200 MHz F1150NBGI

Pin(s)

Name

RF_A

2, 8, 20

3, 5, 7,18, 22,

24, 28

4, 6, 12, 15, 31,

23, 26, 27, 34

10, 16, 21, 30,

RF_Artn,

RF_Brtn,

LO_rtn

GND

N.C.

VCC

RF_B

IF_BiasB

13, 14

32, 33

IFB+, IFB-

LO1_ADJ

LO_in

LC_MODE

STBY

LO2_ADJ

IFA-, IFA+

IF_BiasA

â EP

Function

Main Channel RF Input. Internally matched to 50â¦. DO NOT

apply DC to these pins

Transformer Ground Returns. Ground these pins.

Ground these pins.

No Connection. Not internally connected. OK to connect to Vcc.

OK to connect to GND

Power Supplies. Bypass to GND with capacitors shown in the

Typical Application Circuit as close as possible to pin.

Diversity Channel RF Input. Internally matched to 50â¦

Connect the specified resistor from this pin to ground to set the

bias for the Diversity IF amplifier. This is NOT a current set

resistor

Diversity Mixer Differential IF Output. Connect pullup inductors

from each of these pins to VCC (see the Typical Application

Circuit).

Connect the specified resistor for either Standard or LC mode

from this pin to ground to set the LO common buffer Icc

Local Oscillator Input. Connect the LO to this port through a

series 3 pF capacitor

Low_Current Mode. Set this pin to low or ground for LC mode.

Set to high or No-Connect for Standard mode. There is an

internal pull-up resistor.

STBY Mode. Pull this pin high for Standby mode (~20 mA). Pull

low or Ground for normal Operation

Connect the specified resistor for either Standard or LC mode

from this pin to ground to set the LO drive buffers Icc

Main Mixer Differential IF Output. Connect pullup inductors from

each of these pins to VCC (see the Typical Application Circuit).

Connect the specified resistor from this pin to ground to set the

bias for the Main IF amplifier. This is NOT a current set resistor

Exposed Pad. Internally connected to GND. Solder this exposed

pad to a PCB pad that uses multiple ground vias to provide heat

transfer out of the device into the PCB ground planes. These

multiple via grounds are also required to achieve the noted RF

performance.

IDT Zero-DistortionTM Mixer

Rev2, July 2012

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