92HD99B Datasheet, PDF (222/225 Pages) Integrated Device Technology – SINGLE CHIP PC AUDIO SYSTEM

92HD99
SINGLE CHIP PC AUDIO SYSTEM, CODEC+SPEAKER AMPLIFIER+CAPLESS HP+LDO
8.1. Standard Reflow Profile Data
Note: These devices can be hand soldered at 360 ^oC for 3 to 5 seconds.
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices” (www.jedec.org/download).
Profile Feature
Average Ramp-Up Rate (Ts_max - Tp)
Preheat:
Temperature Min (Ts_min)
Temperature Max (Ts_max)
Time (ts_min - ts_max)
Time maintained above:
Temperature (T_L)
Time (t_L)
Peak / Classification Temperature (Tp)
Time within 5 ^oC of actual Peak Temperature (tp)
Ramp-Down rate
Time 25 ^oC to Peak Temperature
3 ^oC / second max
150 ^oC
200 ^oC
60 - 180 seconds
217 ^oC
60 - 150 seconds
Pb Free Assembly
See “Package Classification Reflow Temperatures”
20 - 40 seconds
6 ^oC / second max
8 minutes max
Note: All temperatures refer to topside of the package, measured on the package body surface.
Table 30. Standard Reflow Profile
IDT CONFIDENTIAL
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92HD99