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ICS9EMS9633 Datasheet, PDF (21/22 Pages) Integrated Device Technology – ULTRA MOBILE PC CLOCK FOR EMBEDDED APPLICATIONS
ICS9EMS9633
ULTRA MOBILE PC CLOCK FOR EMBEDDED APPLICATIONS
Datasheet
Index Area
N
Top View
D
Chamfer 4x
0.6 x 0.6 max
OPTIONAL
Seating Plane
A1
Anvil
Singulation
OR
Sawn
Singulation
A
0. 08 C
A3 L
E2 E2
2
e
(Re f.)
ND & N
Odd
C
(ND -1)x e
(Ref.)
N
D2
2
D2
(Ref.)
ND & N
Even
e (Typ.)
2 If ND & N
1 are Even
2
(N -1)x e
(Ref.)
b
Thermal
Base
THERMALLY ENHANCED, VERY THIN, FINE PITCH
QUAD FLAT / NO LEAD PLASTIC PACKAGE
DIMENSIONS
SYMBOL
A
A1
A3
b
e
MIN.
MAX.
0.8
1.0
0
0.05
0.20 Reference
0.18
0.3
0.40 BASIC
DIMENSIONS
SYMBOL
N
ND
NE
D x E BASIC
D2 MIN. / MAX.
E2 MIN. / MAX.
L MIN. / MAX.
48L
TOLERANCE
48
12
12
6.00 x 6.00
3.95 / 4.25
3.95 / 4.25
0.30 / 0.50
Ordering Information
Part/Order Number
9EMS9633BKILF
9EMS9633BKILFT
9EMS9633BFILF
9EMS9633BFILFT
Shipping Packaging
Tubes
Tape and Reel
Tubes
Tape and Reel
Package
48-pin MLF
48-pin MLF
48-pin SSOP
48-pin SSOP
Temperature
-40 to +85° C
-40 to +85° C
-40 to +85° C
-40 to +85° C
Parts that are ordered w ith a “LF” suffix to the part num ber are the Pb-Free configuration and are RoHS com pliant.
Due to package size constraints, actual top-side m arking m ay differ from the full orderable part num ber.
IDTTM/ICSTM Ultra Mobile PC Clock for Embedded Applications
21
1617—08/19/09