92HD700 Datasheet, PDF (178/181 Pages) Integrated Device Technology – 10-CHANNEL HIGH DEFINITION AUDIO CODEC

92HD700
10-CHANNEL HIGH DEFINITION AUDIO CODEC
PC AUDIO
10. SOLDER REFLOW PROFILE
10.1. Standard Reflow Profile Data
Note: These devices can be hand soldered at 360 ^oC for 3 to 5 seconds.
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices” (www.jedec.org/download).
Profile Feature
Pb Free Assembly
Average Ramp-Up Rate (Ts_max - Tp)
Preheat
Temperature Min (Ts_min)
Temperature Max (Ts_max)
Time (ts_min - ts_max)
Time maintained above
Temperature (T_L)
Time (t_L)
3 ^oC / second max
150 ^oC
200 ^oC
60 - 180 seconds
217 ^oC
60 - 150 seconds
Peak / Classification Temperature (Tp)
Time within 5 ^oC of actual Peak Temperature (tp)
See “Package Classification Reflow Temperatures”
on page 179.
20 - 40 seconds
Ramp-Down rate
Time 25 ^oC to Peak Temperature
6 ^oC / second max
8 minutes max
Note: All temperatures refer to topside of the package, measured on the package body surface.
Figure 5. Solder Reflow Profile
IDT™ 10-CHANNEL HIGH DEFINITION AUDIO CODEC
178
IDT CONFIDENTIAL
92HD700
V 1.2 112006