92HD202 Datasheet, PDF (165/168 Pages) Integrated Device Technology – 8-CHANNEL HIGH DEFINITION AUDIO CODEC

92HD202
8-CHANNEL HIGH DEFINITION AUDIO CODEC
PC AUDIO
11. SOLDER REFLOW PROFILE
11.1. Standard Reflow Profile Data
Note: These devices can be hand soldered at 360 ^oC for 3 to 5 seconds.
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount
Devices” (www.jedec.org/download).
Profile Feature
Pb Free Assembly
Average Ramp-Up Rate (Ts_max - Tp)
Preheat
Temperature Min (Ts_min)
Temperature Max (Ts_max)
Time (ts_min - ts_max)
Time maintained above
Temperature (T_L)
Time (t_L)
3 ^oC / second max
150 ^oC
200 ^oC
60 - 180 seconds
217 ^oC
60 - 150 seconds
Peak / Classification Temperature (Tp)
Time within 5 ^oC of actual Peak Temperature (tp)
See “Package Classification Reflow Temperatures”
on page 166.
20 - 40 seconds
Ramp-Down rate ₆ ^o_{C / second max}
Time 25 ^oC to Peak Temperature _{8 minutes max}
Note: All temperatures refer to topside of the package, measured on the package body surface.
Figure 6. Solder Reflow Profile
IDT™ 8-CHANNEL HIGH DEFINITION AUDIO CODEC
165
IDT CONFIDENTIAL
92HD202
REV 1.2 112006