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F1100 Datasheet, PDF (14/17 Pages) Integrated Device Technology – RF to IF Dual Downconverting Mixer
RF to IF Dual Downconverting Mixer
PIN DESCRIPTIONS
F1100
DATASHEET
698 - 915 MHz F1100NBGI
Pin
1
2, 8, 20
3, 5, 7, 18, 24,
28
4, 6, 12, 15,
31, 23, 26, 34
10, 16, 21, 30,
36
9
11
13, 14
17
19, 27
25
22
29
32, 33
35
Name
RF_A
RF_Artn,
RF_Brtn, LO_rtn
GND
N.C.
VCC
RF_B
IF_BiasB
IFB+, IFB-
LO1_ADJ
LO_in
LO_in_alt
NC
STBY
LO2_ADJ
IFA-, IFA+
IF_BiasA
— EP
Function
Main Channel RF Input. Internally matched to 50Ω. DO NOT
apply DC to these pins
Transformer Ground Returns. Ground these pins.
Ground these pins.
No Connection. Not internally connected. OK to connect to Vcc.
OK to connect to GND
Power Supply. Bypass to GND with capacitors shown in the
Typical Application Circuit as close as possible to pin.
Diversity Channel RF Input. Internally matched to 50Ω
Connect the specified resistor from this pin to ground to set the
bias for the Diversity IF amplifier. This is NOT a current set
resistor
Diversity Mixer Differential IF Output. Connect pullup inductors
from each of these pins to VCC (see the Typical Application
Circuit).
Connect the specified resistor for either Standard or LC mode
from this pin to ground to set the LO common buffer Icc
Local Oscillator Input. Connect the LO to this port through the
recommended coupling capacitor. Note that you can only
drive one LO port at a time. Remove the series capacitor
from the unused port.
Make Certain this pin is not connected. It is normally reserved
for selecting low current mode which the F1100 does not offer
STBY Mode. Pull this pin high for Standby mode (~28 mA). Pull
low or Ground for normal Operation
Connect the specified resistor for either Standard or LC mode
from this pin to ground to set the LO drive buffers Icc
Main Mixer Differential IF Output. Connect pullup inductors from
each of these pins to VCC (see the Typical Application Circuit).
Connect the specified resistor from this pin to ground to set the
bias for the Main IF amplifier. This is NOT a current set resistor
Exposed Pad. Internally connected to GND. Solder this exposed
pad to a PCB pad that uses multiple ground vias to provide heat
transfer out of the device into the PCB ground planes. These
multiple via grounds are also required to achieve the noted RF
performance.
IDT Zero-DistortionTM Mixer
14
RevO, Feb 2013