ZSSC3016 Datasheet, PDF (1/45 Pages) List of Unclassifed Manufacturers – Low Power, High Resolution 16-Bit Sensor Signal Conditioner

Low Power, High Resolution
16-Bit Sensor Signal Conditioner
ZSSC3016
Datasheet
Brief Description
The ZSSC3016 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3016 can perform offset,
span, and 1^st and 2^nd order temperature compensa-
tion of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I²C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP)
running a correction algorithm. Calibration coeffici-
ents are stored on-chip in a highly reliable, non-
volatile, multiple-time programmable (MTP) memory.
Programming the ZSSC3016 is simple via the serial
interface and the PC-controlled calibration software
provided in the IDT Development Kit. The interface
is used for the PC-controlled calibration procedure,
which programs the set of calibration coefficients in
memory. The digital mating is fast and precise,
eliminating the overhead normally associated with
trimming external components and multi-pass
calibration routines.
Features
• Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing, two-
segment analog-to-digital converter (ADC)
• Fully programmable gain amplifier for optimizing
sensor signals: gain range 14 to 72 (linear factor)
• Internal auto-compensated temperature sensor
• Digital compensation of individual sensor offset;
1^st and 2^nd order digital compensation of sensor
gain
• Digital compensation of 1^st and 2^nd order temper-
ature gain and offset drift
• Intelligent power management unit
• Typical sensor elements can achieve accuracy of
better than ±0.10% FSO @ -40 to 85 °C
Benefits
• Integrated 18-bit calibration math DSP
• Fully corrected signal at digital output
• Minimize calibration costs through the one-pass
calibration concept
• No external trimming components required
• Highly integrated CMOS design
• Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
• Excellent for low-voltage and low-power battery
applications
Support
• Evaluation Kit
Physical Characteristics
• Supply voltage range: 1.8 to 3.6V
• Current consumption: 1mA (operating mode)
• Sleep State current: 70nA (25°C)
• Temperature resolution: <0.003K/LSB
• Operation temperature: –40°C to +85 °C
• Small die size
• Delivery options: die for wafer bonding
ZSSC3016 Application Example
VSS
VDD
EOC
Sensor Module
4
Sensor
3
Bridge
2
1
VDD
VSS
ZSSC3016
VSSB
EOC
SEL
SS
INN
VDDB
INP
VPP
MISO
MOSI
SDA
SCLK
SCL
VSS
VDD
SEL
SS
MISO
MOSI_SDA
SCLK_SCL
VPP
6.75V … programming
voltage for setup & calibration
* I²C™ is a trademark of NXP.
Battery
Microcontroller
© 2016 Integrated Device Technology, Inc.
1
January 25, 2016