TB1701-02 Datasheet, PDF (1/3 Pages) Integrated Device Technology – PRODUCT/PROCESS CHANGE NOTICE (PCN)

Integrated Device Technology, Inc.
6024 Silver Creek Valley Road, San Jose, CA 95138
PRODUCT/PROCESS CHANGE NOTICE (PCN)
PCN #: TB1701-02
DATE: February 9, 2017 MEANS OF DISTINGUISHING CHANGED DEVICES:
Product Affected:
F2250, F2255, F2258 products. Refer
to the attached list for orderable part
numbers
Date Effective:
May 9, 2017
Product Mark
Back Mark
Date Code
Other
Assembly Lot Number
Contact:
E-mail:
IDT PCN DESK
[e-mail]
Attachment:
Yes
No
Samples:
Please contact your local sales representative for
sample request.
DESCRIPTION AND PURPOSE OF CHANGE:
Die Technology
Wafer Fabrication Process
Assembly Process
Equipment
Datasheet limit change for Idd supply current, and Ictrl, Vmode leakage currents per Table
1.
The is no change to the die/package technology or manufacturing.
Material
Testing
The purpose of the change is for yield improvement.
Manufacturing Site
Data Sheet
Other - Die revision
RELIABILITY/QUALIFICATION SUMMARY:
There is no change to the product quality or reliability performance.
CUSTOMER ACKNOWLEDGMENT OF RECEIPT:
IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail
to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice
it will be assumed that this change is acceptable.
Customer:
Approval for shipments prior to effective date.
Name/Date:
E-Mail Address:
Title:
Phone # /Fax #:
CUSTOMER COMMENTS:
IDT ACKNOWLEDGMENT OF RECEIPT:
RECD. BY:
DATE:
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