IDT7M1001 Datasheet, PDF (1/11 Pages) Integrated Device Technology – 128K x 8 64K x 8 CMOS DUAL-PORT STATIC RAM MODULE

®
Integrated Device Technology, Inc.
128K x 8
64K x 8
CMOS DUAL-PORT
STATIC RAM MODULE
IDT7M1001
IDT7M1003
FEATURES
• High-density 1M/512K CMOS Dual-Port Static RAM
module
• Fast access times:
—Commercial 35, 40ns
—Military 40, 50ns
• Fully asynchronous read/write operation from either port
• Full on-chip hardware support of semaphore signaling
between ports
• Surface mounted LCC (leadless chip carriers) compo-
nents on a 64-pin sidebraze DIP (Dual In-line Package)
• Multiple Vcc and GND pins for maximum noise immunity
• Single 5V (±10%) power supply
• Input/outputs directly TTL-compatible
PIN CONFIGURATION⁽¹⁾
VCC 1
R/WL 2
OEL 3
CSL 4
SEML 5
A0L 6
A1L 7
GND 8
A2L 9
A3L 10
A4L 11
A5L 12
A6L 13
A7L 14
A8L 15
A9L 16
A10L 17
A11L 18
A12L 19
A13L 20
A14L 21
A15L 22
A16L 23
I/O 0L 24
I/O 1L 25
I/O 2L 26
I/O 3L 27
I/O 4L 28
I/O 5L 29
I/O 6L 30
I/O 7L 31
GND 32
64 GND
63 R/WR
62 OER
61 CSR
60 SEMR
59 A0R
58 A1R
57 A2R
56 A3R
55 A4R
54 A5R
53 A6R
52 A7R
51 A8R
50 A9R
49 A10R
48 A11R
47 A12R
46 A13R
45 A14R
44 A15R
43 A16R
42 GND
41 I/O0R
40 I/O1R
39 I/O2R
38 I/O3R
37 I/O4R
36 I/O5R
35 I/O6R
34 I/O7R
33 VCC
2804 drw 01
DIP
TOP VIEW
NOTE:
1. For the IDT7M1003 (64K x 8) version, Pins 23 and 43 must be connected
to GND for proper operation of the module.
DESCRIPTION:
The IDT7M1001/IDT7M1003 is a 128K x 8/64K x 8 high-
speed CMOS Dual-Port Static RAM module constructed on a
multilayer ceramic substrate using eight IDT7006 (16K x 8)
Dual-Port RAMs and two IDT FCT138 decoders or depopu-
lated using only four IDT7006s and two decoders.
This module provides two independent ports with separate
control, address, and I/O pins that permit independent and
asynchronous access for reads or writes to any location in
memory. System performance is enhanced by facilitating
port-to-port communication via semaphore (SEM) “hand-
shake” signaling. The IDT7M1001/1003 module is designed
to be used as stand-alone Dual-Port RAM where on-chip
hardware port arbitration is not needed. It is the users re-
sponsibility to ensure data integrity when simultaneously
accessing the same memory location from both ports.
The IDT7M1001/1003 module is packaged on a multilayer
co-fired ceramic 64-pin DIP (Dual In-line Package) with di-
mensions of only 3.2" x 0.62" x 0.38". Maximum access times
as fast as 35ns over the commercial temperature range are
available.
All inputs and outputs of the IDT7M1001/1003 are TTL-
compatible and operate from a single 5V supply. Fully asyn-
chronous circuitry is used, requiring no clocks or refreshing for
operation of the module.
All IDT military module semiconductor components are
manufacured in compliance with the latest revision of MIL-
STD-883, Class B, making them ideally suited to applications
demanding the highest level of performance and reliability.
PIN NAMES
Left Port
Right Port
A (0–16)L
I/O (0–7)L
R/WL
A (0–16)R
I/O (0–7)R
R/WR
CSL
CSR
OEL
OER
SEML
SEMR
VCC
GND
Description
Address Inputs
Data Inputs/Outputs
Read/Write Enables
Chip Select
Output Enable
Semaphore Control
Power
Ground
2804 tbl 01
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES
©1995 Integrated Device Technology, Inc.
7.5
MARCH 1995
DSC-7066/5
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