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IDT71T75702_09 Datasheet, PDF (1/26 Pages) Integrated Device Technology – Synchronous ZBT SRAMs
512K x 36, 1M x 18
2.5V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Flow-Through Outputs
IDT71T75702
IDT71T75902
Features
x 512K x 36, 1M x 18 memory configurations
x Supports high performance system speed - 100 MHz
(7.5 ns Clock-to-Data Access)
x ZBTTM Feature - No dead cycles between write and read cycles
x Internally synchronized output buffer enable eliminates the
need to control OE
x Single R/W (READ/WRITE) control pin
x 4-word burst capability (Interleaved or linear)
x Individual byte write (BW1 - BW4) control (May tie active)
x Three chip enables for simple depth expansion
x 2.5V power supply (±5%)
x 2.5V (±5%) I/O Supply (VDDQ)
x Power down controlled by ZZ input
x Boundary Scan JTAG Interface (IEEE 1149.1 Compliant)
x Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA)
Description
The IDT71T75702/902 are 2.5V high-speed 18,874,368-bit
(18 Megabit) synchronous SRAMs organized as 512K x 36 /1M x 18.
They are designed to eliminate dead bus cycles when turning the bus
around between reads and writes, or writes and reads. Thus they have
been given the name ZBTTM, or Zero Bus Turnaround.
Address and control signals are applied to the SRAM during one clock
cycle, and on the next clock cycle the associated data cycle occurs, be
it read or write.
The IDT71T75702/902 contain address, data-in and control signal
registers. The outputs are flow-through (no output data register). Output
enable is the only asynchronous signal and can be used to disable the
outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71T75702/902
to be suspended as long as necessary. All synchronous inputs are
ignored when CEN is high and the internal device registers will hold their
previous values.
There are three chip enable pins (CE1, CE2, CE2) that allow the
user to deselect the device when desired. If any one of these three is not
asserted when ADV/LD is low, no new memory operation can be initiated.
However, any pending data transfers (reads or writes) will be completed.
The data bus will tri-state one cycle after the chip is deselected or a write
is initiated.
The IDT71T75702/902 have an on-chip burst counter. In the burst
mode, the IDT71T75702/902 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is
defined by the LBO input pin. The LBO pin selects between linear and
interleaved burst sequence. The ADV/LD signal is used to load a new
external address (ADV/LD = LOW) or increment the internal burst counter
(ADV/LD = HIGH).
The IDT71T75702/902 SRAMs utilize IDT’s high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm
100-pin plastic thin quad flatpack (TQFP) as well as a 119 ball grid array
(BGA).
Pin Description Summary
A0-A19
Address Inputs
Input
Synchronous
CE1, CE 2, CE2
Chip Enables
Input
Synchronous
OE
Output Enable
Input
Asynchronous
R/W
Read/Write Signal
Input
Synchronous
CEN
Clock Enable
Input
Synchronous
BW1, BW2, BW3, BW4
Individual Byte Write Selects
Input
Synchronous
CLK
Clock
Input
N/A
ADV/LD
Advance Burst Address/Load New Address
Input
Synchronous
LBO
Linear/Interleaved Burst Order
Input
Static
TMS
Test Mode Select
Input
N/A
TDI
Test Data Input
Input
N/A
TCK
Test Clock
Input
N/A
TDO
Test Data Output
Output
N/A
TRST
JTAG Reset (Optional)
Input
Asynchronous
ZZ
Sleep Mode
Input
Synchronous
I/O0-I/O31, I/OP1-I/OP4
Data Input/Output
I/ O
Synchronous
VDD, VDDQ
Core Power, I/O Power
Sup p ly
Static
VSS
Ground
Sup p ly
Static
1
©2004 Integrated Device Technology, Inc.
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