ICS83026I-01 Datasheet, PDF (12/14 Pages) Integrated Circuit Systems – LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER

Integrated
Circuit
Systems, Inc.
ICS83026I-01
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
PACKAGE OUTLINE - SUFFIX M FOR 8 LEAD SOIC
PACKAGE OUTLINE - G SUFFIX FOR 8 LEAD TSSOP
TABLE 6A. PACKAGE DIMENSIONS
SYMBOL
Millimeters
MINIMUM
MAXIMUM
N
8
A
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
4.80
5.00
E
3.80
4.00
e
1.27 BASIC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
α
0°
8°
Reference Document: JEDEC Publication 95, MS-012
TABLE 6B. PACKAGE DIMENSIONS
SYMBOL
Millimeters
Minimum
Maximum
N
8
A
--
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
2.90
3.10
E
6.40 BASIC
E1
4.30
4.50
e
0.65 BASIC
L
0.45
0.75
α
0°
8°
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-153
83026BMI-01
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REV. A JANUARY 16, 2006
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