ICSSSTU32864 Datasheet, PDF (11/11 Pages) Integrated Circuit Systems – 25-Bit Configurable Registered Buffer

ICSSSTU32864
C
Seating
Plane
A1
b
T
REF
D
TOP VIEW
d TYP
D1
Numeric Designations
for Horizontal Grid
4 321
A
B
C
D
Alpha Designations
for Vertical Grid
(Letters I, O, Q & S
not used)
- e - TYP
E
h
c
TYP
REF
- e - TYP
0.12 C
E1
ALL DIMENSIONS IN MILLIMETERS
D
E
T
Min/Max
----- BALL GRID -----
Max.
e
HORIZ
VERT
TOTAL
d
Min/Max
16.00 Bsc 5.50 Bsc 1.30/1.50 0.80 Bsc
6
13.50 Bsc 5.50 Bsc 1.30/1.50 0.80 Bsc
6
7.00 Bsc 4.50 Bsc 0.86/1.00 0.65 Bsc
6
19
114
0.40/0.50
16
96
0.40/0.50
10
60
0.35/0.45
Note: Ball grid total indicates maximum ball count for package. Lesser quantity may be used.
h
Min/Max
0.31/0.41
0.25/0.41
0.15/0.21
REF. DIMENSIONS
b
c
0.80
0.75
0.575
0.75
0.75
0.625
10-0055C
* Source Ref.: JEDEC Publication 95, MO-205
Ordering Information
ICSSSTU32864yHT
Example:
ICS XXXX y H - T
0727C—04/15/04
Designation for tape and reel packaging
Package Type
H = BGA
Revision Designator (will not correlate with datasheet revision)
Device Type
Prefix
ICS = Standard Device
11