IC-PN2656 Datasheet, PDF (4/7 Pages) IC-Haus GmbH – PHASED ARRAY NONIUS ENCODER 26-256

iC-PN2656
preliminary
PHASED ARRAY NONIUS ENCODER 26-256
Rev A4, Page 4/7
ABSOLUTE MAXIMUM RATINGS
These ratings do not imply operating conditions; functional operation is not guaranteed. Beyond these ratings device damage may occur.
Item Symbol Parameter
No.
Conditions
Min.
Unit
Max.
G001 VCC
Voltage at VCC
-0.3
6
V
G002 I(VCC) Current in VCC
-20
20
mA
G003 V()
Pin Voltage, all signal outputs
-0.3
VCC +
V
0.3
G004 I()
Pin Current, all signal outputs
-20
20
mA
G005 Vd()
ESD Susceptibility, all pins
HBM, 100 pF discharged through 1.5 kΩ
2
kV
G006 Tj
Junction Temperature
-40
150
°C
G007 Ts
Chip Storage Temperature
-40
150
°C
THERMAL DATA
Item Symbol
No.
T01 Ta
T02 Ts
T03 Tpk
T04 Tpk
T05 Tpk
Parameter
Conditions
Operating Ambient Temperature Range package cQFN32 (clear)
package oQFN32 (black)
package oBGA LSH2C
Storage Temperature Range
package cQFN32 (clear)
package oQFN32 (black)
package oBGA LSH2C
Soldering Peak Temperature
package cQFN32 (clear)
Unit
Min. Typ. Max.
-20
70 °C
-40
110* °C
-40
125 °C
-20
70 °C
-40
110* °C
-40
125 °C
tpk < 10 s, convection reflow
MSL 5A (max. floor live 24 h at 30 °C and
60 % RH)
245 °C
Soldering Peak Temperature
Please refer to customer information file No. 7
for details.
Not suitable for vapour phase soldering.
package cQFN32 (black)
tpk < 10 s, convection reflow
MSL 3 (max. floor live 168 h at 30 °C and
60 % RH)
245* °C
Soldering Peak Temperature
Please refer to customer information file No. 7
for details.
Not suitable for vapour phase soldering.
package oQFN32 (black)
package oBGA LSH2C
tpk < 20 s, convection reflow
tpk < 20 s, vapor phase soldering
260 °C
230 °C
TOL (time on label) 8 h;
Please refer to customer information file No. 7
for details.
*) Package qualification pending.
All voltages are referenced to ground unless otherwise stated.
All currents into the device pins are positive; all currents out of the device pins are negative.