IC-NZP_11 Datasheet, PDF (4/15 Pages) IC-Haus GmbH – P-TYPE LASER DIODE DRIVER

iC-NZP
P-TYPE LASER DIODE DRIVER
preliminary
Rev B1, Page 4/15
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item Symbol Parameter
No.
Conditions
G001 VDD
Voltage at VDD
G002 I(VDD) Current in VDD
DC current
G003 I(CI)
Current in CI
V(LDA) = 0
G004 I(NERR) Current in NERR
G005 I(MD)
Current in MD
G006 I()dig
Current in EP, EN, TTL, REGE, NSLP,
AVG, NCID
G007 I(VDDL) Current in VDDL
DC current
G008 I(VDDA) Current in VDDA
DC current
G009 I(LDA)
Current in LDA
DC current
G010 I(RSI)
Current in RSI
G011 I(VSY) Current in VSY
G012 I(SYN) Current in SYN
G013 I(IMON) Current in IMON
G014 V()c
Voltage at RSI, VSY, SYN, EP, EN,
TTL, REGE, AVG, NCID, RGND, MD,
CI, IMON, RVDD, LDA, NERR, NSLP
G015 Vd()
ESD Susceptibility at all pins
HBM, 100 pF discharged through 1.5 kΩ
G016 Tj
Operating Junction Temperature
G017 Ts
Storage Temperature Range
Min.
-0.7
-2
-2
-2
-2
-2
Unit
Max.
6
V
1200 mA
5
mA
20
mA
20
mA
20
mA
-2
1200 mA
-1200
2
mA
-1200
2
mA
-2
20
mA
-2
50
mA
-2
50
mA
-20
2
mA
-0.7
6
V
4
kV
-40
190
°C
-40
190
°C
THERMAL DATA
Operating Conditions: VDD = 3...5.5 V
Item Symbol Parameter
No.
Conditions
Unit
Min. Typ. Max.
T01 Ta
Operating Ambient Temperature Range
(extended range on request)
-20
85 °C
T02 Rthja
Thermal Resistance Chip/Ambient
surface mounted, thermal pad soldered to ca.
2 cm² heat sink
30 40 K/W
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.