HY64UD16162B Datasheet, PDF (10/11 Pages) Hynix Semiconductor – 1M x 16 bit Low Low Power 1T/1C Pseudo SRAM

PACKAGE DIMENSION
48ball Fine Pitch Ball Grid Array Package(F)
A1 CORNER
INDEX AREA
TTOOPPVVIIEEWW
B
HY64UD16162B Series
BBOOTTTTOOMMVVIIEEWW
B1
A
A1 INDEX
MARK
C _C1
A
B
C
D
E
F
G
H
654321
A
C/2
5
C
E
SSIIDDEEVVIIEEWW
B/2
E1
E2 SEATING PLANE 4
Symbol
A
B
B1
C
C1
D
E
E1
E2
R
A
3 D(DIAMETER)
unit : mm
Min.
Typ.
Max.
-
0.75
-
5.90
6.00
6.10
-
3.75
-
7.90
8.00
8.10
-
5.25
-
0.30
0.35
0.40
-
1.00
1.10
-
0.75
-
0.20
0.25
0.30
-
-
0.08
R
NOTE.
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE MILLIMETERS.
3. DIMENSION “D” IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.
4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE
CROWN OF THE SOLDER BALLS.
5. THIS IS A CONTROLLING DIMENSION.
Revision 1.0 / December. 2002
10