HYMD132G725BL8-M Datasheet, PDF (1/17 Pages) Hynix Semiconductor – Registered DDR SDRAM DIMM

DESCRIPTION
32Mx72 bits
Registered DDR SDRAM DIMM
HYMD132G725B(L)8-M/K/H/L
Hynix HYMD132G725B(L)8-M/K/H/L series is registered 184-pin double data rate Synchronous DRAM Dual In-Line
Memory Modules (DIMMs) which are organized as 32Mx72 high-speed memory arrays. Hynix HYMD132G725B(L)8-M/
K/H/L series consists of eighteen 16Mx8 DDR SDRAM in 400mil TSOP II packages on a 184pin glass-epoxy substrate.
Hynix HYMD132G725B(L)8-M/K/H/L series provide a high performance 8-byte interface in 5.25" width form factor of
industry standard. It is suitable for easy interchange and addition.
Hynix HYMD132G725B(L)8-M/K/H/L series is designed for high speed of up to and offers fully synchronous operations
referenced to both rising and falling edges of differential clock inputs. While all addresses and control inputs are
latched on the rising edges of the clock, Data, Data strobes and Write data masks inputs are sampled on both rising
and falling edges of it. The data paths are internally pipelined and 2-bit prefetched to achieve very high bandwidth. All
input and output voltage levels are compatible with SSTL_2. High speed frequencies, programmable latencies and
burst lengths allow variety of device operation in high performance memory system.
Hynix HYMD132G725B(L)8-M/K/H/L series incorporates SPD(serial presence detect). Serial presence detect function is
implemented via a serial 2,048-bit EEPROM. The first 128 bytes of serial PD data are programmed by Hynix to identify
DIMM type, capacity and other the information of DIMM and the last 128 bytes are available to the customer.
FEATURES
• 256MB (32M x 72) Registered DDR DIMM based on
16Mx8 DDR SDRAM
• JEDEC Standard 184-pin dual in-line memory module
(DIMM)
• Error Check Correction (ECC) Capability
• Registered inputs with one-clock delay
• Phase-lock loop (PLL) clock driver to reduce loading
• 2.5V +/- 0.2V VDD and VDDQ Power supply
• All inputs and outputs are compatible with SSTL_2
interface
• Fully differential clock operations (CK & /CK) with
100MHz/125MHz/133MHz
• Programmable CAS Latency 2 / 2.5 supported
• Programmable Burst Length 2 / 4 / 8 with both
sequential and interleave mode
• tRAS Lock-out function supported
• Internal four bank operations with single pulsed RAS
• Auto refresh and self refresh supported
• 4096 refresh cycles / 64ms
ORDERING INFORMATION
Part No.
HYMD132G725B(L)8-M
HYMD132G725B(L)8-K
HYMD132G725B(L)8-H
HYMD132G725B(L)8-L
Power Supply
Clock Frequency
VDD=2.5V
VDDQ=2.5V
133MHz (*DDR266:2-2-2)
133MHz (*DDR266A)
133MHz (*DDR266B)
125MHz (*DDR200)
Interface
SSTL_2
Form Factor
184pin Registered DIMM
5.25 x 1.7 x 0.15 inch
* JEDEC Defined Specifications compliant
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.3/May. 02
1