DB201S Datasheet, PDF (1/2 Pages) HY ELECTRONIC CORP. – SURFACE MOUNT GLASS PASSIVATED BRIDEG RECTIFIERS

DB201S thru DB207S
SURFACE MOUNT
GLASS PASSIVATED
BRIDEG RECTIFIERS
REVERSE VOLTAGE - 50 to 1000Volts
FORWARD CURRENT - 2.0 Amperes
FEATURES
●Rating to 1000V PRV
●Ideal for printed circuit board
●Low forward voltage drop,high current capability
●Reliable low cost construction utilizing molded plastic
technique results in inexpensive product
●Lead tin Pb/Sn copper
●The plastic material has UL flammability
classification 94V-0
MECHANICAL DATA
DBS
.047(1.2)
.037(0.95)
-+
.335(8.5)
.307(7.8)
.256(6.5)
.244(6.2)
~~
.406(10.3)
.391(10.0)
.140(0.35)
.008(0.2)
●Polarit: As marked on Body
●Weight: 0.02 ounces,0.38 gras
●Mounting position: Any
.063(1.6)
.055(1.4)
.346(8.8)
.323(8.2)
.205(5.2)
.197(5.0)
.134(3.4)
.124(3.15)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25℃ ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
CHARACTERISTICS
SYMBOL DB201S DB202S DB203S DB204S DB205S DB206S DB207S
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
700
Maximum DC Blocking Voltage
VDC
50
100
200
400
600
800
1000
Maximum Average Forward
I(AV)
2.0
Rectified Current
@TA=40℃
Peak Forward Surage Current
8.3ms Single Half Sine-Wave
IFSM
60
Super Imposed on Rated Load (JEDEC .Method)
Maximum Forward Voltage at 2.0A DC
VF
1.1
Maximum DC Reverse Current @TJ=25℃
10
IR
at Rated DC Blocking Voltage @TJ=125℃
500
I²t Rating for Fusing (t<8.3ms)
I²t
10.4
Typical Junction capacitance Per Element(Note1)
CJ
25
Typical Thermal Resistance (Note2)
RθJC
40
Operating Temperature Range
Storage Temperature Range
TJ
TSTG
-55 to +150
-55 to +150
UNIT
V
V
V
A
A
V
uA
A²s
pF
℃/W
℃
℃
Note:1.Measured at 1.0MHz and applied reverse voltage of 4.0V DC
2.Thermal resistance from junction to ambient mounted on P.C.B
with 0.5*0.5"(13*13mm) copper pads.
~ 239 ~