DIR-1B Datasheet, PDF (1/4 Pages) HuaXinAn Electronics CO.,LTD – Epoxy molded Dual-In-Line package

DIR
Main Feature
1. Epoxy molded Dual-In-Line package.
2. Low profile, mounting space compatible with DIP IC.
3. Completely washable.
4. Provide high speed, miniature and cost effective
switching solution.
Contact Rating
Load Type
Rated Load (Resistive)
Rated Carrying Current
Max. Allowable Voltage
Max. Allowable Current
Max. Allowable Power Force
Min. Switching Load
Contact Material
Contact Form
Application
Security System, Modem and Telecommunication
Products.
Performance (at Initial Value)
Contact Resistance ............. 150 mΩ Max.@
100mA, 6VDC
Operate Time ...................... 0.5 mSec. Max.
Release Time ...................... 0.5 mSec. Max.
Dielectric Strength:
Between Coil & Contact ...... 1,400 VDC.
4,000 VDC (4 Lead)
Insulation Resistance: ......... 100 MΩ Minimum
Between Contacts ............... 200 VDC
0.5A 100VDC
0.5A
100 VDC
0.5A
10 VA
DC 1V, 1mA
Ru Alloy
SPST/DPST
DIR/DID
0.2A 30VDC
0.2A
30 VDC
0.2A
3 VA
DC 1V, 1mA
Ru Alloy
SPDT
Temperature Range:
Operating .............................-40~85 °C.
Storage ................................-55~125 °C.
Humidity Range ...................45~85% RH.
Vibration...............................20 G.
Shock .................................100 G.
Life Expectancy:
Electrical ..............................10⁸ Operations at
ref. 10VDC, 10mA
Weight………………………..About 1.8g
Safety Standard & File Number
UL & C-UL............................E141060