TJ47300 Datasheet, PDF (1/14 Pages) HTC Korea TAEJIN Technology Co. – 3.0A Low Output Voltage Ultra LDO Regulator

3.0A Low Output Voltage Ultra LDO Regulator
TJ47300
FEATURES
 Works with 1.25V ~ 5.5V V_IN
 Ultra Low Dropout Voltage
 Low Quiescent Current
 Excellent Line and Load Regulation
 Guaranteed Output Current of 3.0A
 Adjustable Output Voltage Down to 0.8V
 V_OUT Power OK Signal
 Logic Controlled Shutdown Option
 Over-Temperature/Over-Current Protection
 -40℃ to 125℃ Junction Temperature Range
SOP‐8‐PP
APPLICATION
 Motherboards and Graphic Cards
 Microprocessor and Chipset Power Supplies
 Peripheral Cards
 Low Voltage Digital ICs
 High Efficiency Linear Regulators
DESCRIPSION
The TJ47300 is a 3.0A high performance ultra low-
dropout linear regulator ideal for powering core voltages
of low-power microprocessors. The TJ47300 implements
a dual supply configuration allowing for very low output
impedance. The TJ47300 requires a bias input supply
and a main input supply, allowing for ultra-low input
voltages on the main supply rail. The input supply
operates from 1.25V to 5.5V and the bias supply requires
between 3V and 5.5V for proper operation. The TJ47300
delivers high current and ultra-low-dropout output
voltage as low as 0.8V for applications where V_OUT is very
close to V_IN. The TJ47300 is developed on a CMOS
technology which allows low quiescent current operation
independent of output current. This technology also
allows the TJ47300 to operate under extremely low
dropout conditions.
ORDERING INFORMATION
Device
TJ47300GDP
Package
SOP8-PP
ABSOLUTE MAXIMUM RATINGS
CHARACTERISTIC
SYMBOL
MIN.
MAX.
Input Supply Voltage (Survival)
Enable Input Voltage (Survival)
Bias Supply Voltage (Survival)
Output Voltage (Survival)
Lead Temperature (Soldering, 5 sec)
Storage Temperature Range
Operating Junction Temperature Range
Package Thermal Resistance *
V_IN
V_EN
V_BIAS
V_OUT
T_SOL
T_STG
T_JOPR
Θ_JA-SOP8-PP
-0.3
6
-0.3
6
-0.3
6
-0.3
V_IN +0.3
260
-65
150
-40
125
68
* Calculated from package in still air, mounted to 2.6mm X 3.5mm(minimum foot print) 2 layer PCB without thermal vias per JESD51 standards.
2011 Preliminary
-1-
UNIT
V
V
V
V
℃
℃
℃
ºC/W
HTC