H1563P Datasheet, PDF (7/8 Pages) Hi-Sincerity Mocroelectronics – HIGH-EFFICIENCY DC/DC CONVERTER

HI-SINCERITY
MICROELECTRONICS CORP.
H1563P Dimension (DIP-8P)
Spec. No. : HP200201
HS200207
Issued Date : 2000.10.01
Revised Date : 2002.07.12
Page No. : 7/8
87 6 5
A
12 3 4
B
J
F
Marking:
H
15 63
P
Date Code
DIP-8P Plastic Package
HSMC Package Code: P
C
EG
DH
I
α1 _K
M
L
DIM
Inches
Min.
Max.
A 0.2480 0.2520
B 0.3630 0.3670
C
-
*0.0600
D
-
*0.0500
E
-
*0.0390
F 0.1280 0.1320
G 0.1250 0.1400
Millimeters
Min.
Max.
6.29
6.40
9.22
9.32
-
*1.52
-
*1.27
-
*0.99
3.25
3.35
3.17
3.55
*: Typical
DIM
Inches
Min.
Max.
Millimeters
Min.
Max.
H 0.0150 0.0210 0.38
0.53
I
0.0898 0.1098 2.28
2.79
J 0.2950 0.3050 7.49
7.74
K
-
*0.1181
-
*3.00
L 0.3370 0.7470 8.56
8.81
M 0.0090 0.0150 0.229 0.381
α1
94°
97°
94°
97°
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
H1563P / H1563S
HSMC Product Specification