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H288 Datasheet, PDF (6/6 Pages) Hi-Sincerity Mocroelectronics – 3.0V to 20V operating voltage
HI-SINCERITY
MICROELECTRONICS GROUP.
SIP-4L Dimension
Spec. No. : IC200903
Issued Date : 2009.02.12
Revised Date :
Page No. : 6/6
A
I
B
J
C a1 a2
12 34
H
D
K
F
E
E
G
a2
Marking Site
a1
L
4-Lead SIP-4L Plastic
HSMC Package Code: AD
Marking:
H: 2 8 8
Halogen Free
Mark
Pin Style: 1.VCC 2.DO 3.DOB 4.GND
Hall Sensor Location:
2 .0 0 m m
1 .3 7 m m
To p
V iew
DIM Min. Max.
A 3.962 4.216
B 2.870 3.124
C 13.60 15.60
D 1.245 1.753
E
0.750REF
F 0.406 0.508
G 0.330 0.432
H
1.27REF
I
1.87 2.13
J
1.27 1.53
*: Typical, Unit: mm
Material:
• Lead solder plating: Sn/3.0Ag/0.5Cu or Pure-Tin
(Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056
Fax: 886-2-25632712, 25368454
• AVANTICS Microelectronics Corp: No. 255, Cai Lun Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai, China
Tel: 86-021-58955599 Fax: 86-021-58558038
H288
HSMC Product Specification