H06N60 Datasheet, PDF (5/6 Pages) Hi-Sincerity Mocroelectronics – N-Channel Power Field Effect Transistor

HI-SINCERITY
MICROELECTRONICS CORP.
TO-263 Dimension
Spec. No. : MOS200402
Issued Date : 2004.04.01
Revised Date : 2005.03.10
Page No. : 5/6
A
a1
G
r1
123
H
I
J
KK
a2
2-r2
3-r2
B
L
M
C
a2
DP
D
F
N
P
r2
Q
O
E
R
r2
S
a3
X
Y
2Xr3
F
a2
Marking:
T
U
Pb Free Mark
V
Pb-Free: " . " ^(Note)
Normal: None
H
U
0 6N60
W
Date Code
D
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
E
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-263 Plastic
Surface Mount Package
T
HSMC Package Code: U
( ): Reference Dimension, Unit: mm
DIM
Min.
Max.
DIM
Max.
Max.
DIM
A
9.70
10.10
L
4.30
4.70
W
B
1.00
1.40
M
1.25
1.40
X
C
-
(4.60)
N
-0.05
0.25
Y
D
9.00
9.40
O
2.20
2.60
a1
E
4.70
5.10
P
1.90
2.10
a2
F
15.00
15.60
Q
-
(0.75)
a3
G
-
(0.40)
R
2.24
2.84
r1
H
1.20
1.60
S
0.45
0.60
r2
I
1.17
1.37
T
9.80
10.20
r3
J
0.70
0.90
U
-
(7.00)
DP
K
2.34
2.74
V
-
(4.00)
Min.
Max.
-
(7.20)
-
(0.40)
-
(0.90)
-
(15^o)
-
(3^o)
-
0^o~3^o
-
(φ1.50)
-
0.30
-
(0.45)
-
(0.20)
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]
H06N60U, H06N60E, H06N60F
HSMC Product Specification