HSBR201X0CT Datasheet, PDF (3/5 Pages) Hi-Sincerity Mocroelectronics – Schottky Barrier Rectifiers

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200802
Issued Date : 2008.08.19
Revised Date :2009.11.06
Page No. : 3/5
TO-220AB Dimension
A
D
B
F
E
Marking:
C
H
I
3
G
2
1
Tab
P
L
M
O
J
K
Note: Green label is used for pb-free packing
N
Pin Style: 1.Anode 2.Cathode 3.Anode
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
DIM Min. Max.
A
5.58 7.49
B
8.38 8.90
C
4.40 4.70
D
1.15 1.39
E
0.35 0.60
F
2.03 2.92
G
9.66 10.28
H
- *16.25
I
-
*3.83
J
3.00 4.00
K
0.75 0.95
L
2.54 3.42
M
1.14 1.40
N
-
*2.54
O 12.70 14.27
P 14.48 15.87
*: Typical, Unit: mm
A
D
B
F
E
Marking:
C
H
I
3
G
2
1
Tab
P
L
M
O
J
3-Lead TO-220AB
Plastic Package
HSMC Package Code: E
K
Note: Green label is used for pb-free packing
Pin Style: 1.Anode 2.Cathode 3.Anode
N
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
5.58 7.49
B
8.38 8.90
C
4.40 4.70
D
1.15 1.39
E
0.35 0.60
F
2.03 2.92
G
9.66 10.28
H
- *16.25
I
-
*3.83
J
3.00 4.00
K
0.75 0.95
L
2.54 3.42
M
1.14 1.40
N
-
*2.54
O 12.70 14.27
P 14.48 15.87
*: Typical, Unit: mm
HSBR20100CT Series ~HSBR20150CT Series
HSMC Product Specification