HBAV70_04 Datasheet, PDF (3/4 Pages) Hi-Sincerity Mocroelectronics – Small SMD Package (SOT-23)

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6801
Issued Date : 1995.11.17
Revised Date : 2004.08.26
Page No. : 3/4
SOT-23 Dimension
A
L
3
BS
1
2
V
G
C
D
H
K
J
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Marking:
A4
Pb Free Mark
Pb-Free: " " ^(Note)
Normal: None
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
Pin Style: 1.Anode 2.Anode 3.Cathode
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
2.80 3.04
B
1.20 1.60
C
0.89 1.30
D
0.30 0.50
G
1.70 2.30
H 0.013 0.10
J 0.085 0.177
K
0.32 0.67
L
0.85 1.15
S
2.10 2.75
V
0.25 0.65
*: Typical, Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]
HBAV70
HSMC Product Specification