HFBR-5903 Datasheet, PDF (7/16 Pages) Agilent(Hewlett-Packard) – FDDI, Fast Ethernet Transceivers in 2 x 5 Package Style

Care should be used to avoid
shorting the receiver data or
signal detect outputs directly to
ground without proper current
limiting impedance.
Solder and Wash Process
Compatibility
The transceivers are delivered
with protective process plugs
inserted into the MT-RJ
connector receptacle. This
process plug protects the optical
subassemblies during wave
solder and aqueous wash
processing and acts as a dust
cover during shipping.
These transceivers are compat-
ible with either industry
standard wave or hand solder
processes.
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
Board Layout - Decoupling Circuit,
Ground Planes and Termination
Circuits
It is important to take care in
the layout of your circuit board
to achieve optimum perform-
ance from these transceivers.
Figure 7 provides a good
example of a schematic for a
power supply decoupling circuit
that works well with these parts.
It is further recommended that a
continuous ground plane be
provided in the circuit board
directly under the transceiver to
provide a low inductance
ground for signal return current.
This recommendation is in
keeping with good high
frequency board layout
practices. Figures 7 and 8 show
two recommended termination
schemes.
Board Layout - Hole Pattern
The Agilent transceiver complies
with the circuit board “Common
Transceiver Footprint” hole
pattern defined in the original
multisource announcement
which defined the 2 x 5 package
style. This drawing is repro-
duced in Figure 9 with the
addition of ANSI Y14.5M
compliant dimensioning to be
used as a guide in the mechani-
cal layout of your circuit board.
Figure 8. Alternative Termination Circuits
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