HCPL-2730 Datasheet, PDF (6/12 Pages) Agilent(Hewlett-Packard) – Dual Channel Low Input Current, High Gain Optocouplers

Insulation Related Specifications (HCPL-2731/2730/0731/0730)
Parameter
Symbol
Minimum External Air
Gap (External
Clearance)
L(101)
Minimum External
Tracking (External
Creepage)
L(102)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
CTI
(Comparative Tracking
Index)
Isolation Group
8-Pin DIP
(300 Mil) SO-8
Value Value
7.1
4.9
7.4
4.8
0.08 0.08
200
200
IIIa
IIIa
Units
mm
mm
mm
Volts
Conditions
Measured from input terminals to
output terminals, shortest distance
through air.
Measured from input terminals to
output terminals, shortest distance
path along body.
Through insulation distance, conductor
to conductor, usually the direct
distance between the photoemitter and
photodetector inside the optocoupler
cavity.
DIN IEC 112/ VDE 0303 Part 1
Material Group DIN VDE 0110
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings (No Derating Required up to 85°C)
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Forward Input Current
(50% Duty Cycle, 1 ms Pulse Width)
T_S
-55
T_A
- 40
I_F(AVG)
I_FPK
125
°C
85
°C
20
mA
40
mA
Reverse Input Voltage (Each Channel)
Input Power Dissipation (Each Channel)
Output Current (Each Channel)
Supply Voltage and Output Voltage
(HCPL-2731, HCPL-0731)
(V_CC - Pin 8-5, V_O - Pin 7,6-5) -Note 1
Supply Voltage and Output Voltage
(HCPL-2730, HCPL-0730)
(V_CC - Pin 8-5, V_O - Pin 7,6-5) -Note 1
Output Power Dissipation (Each Channel) -Note 12
Total Power Dissipation (Each Channel)
Lead Solder Temperature (for Through Hole Devices)
V_R
5
V
P_I
35
mW
I_O
60
mA
V_CC
-0.5
18
V
V_CC
-0.5
7
V
P_O
100
mW
P_T
135
mW
260°C for 10 sec., 1.6 mm below seating plane
Reflow Temperature Profile
(for SOIC-8 and Option #300)
See Package Outline Drawings section
1-113