ABA-31563 Datasheet, PDF (6/8 Pages) Agilent(Hewlett-Packard) – 3.5 GHz Broadband Silicon RFIC Amplifier

Device Models
Refer to Agilent’s web site
www.agilent.com/view/rf
Ordering Information
Part Number
Devices per Container
ABA-31563-TR1G
3000
ABA-31563-TR2G
10000
ABA-31563-BLKG
100
Note: Only lead-free option available.
Container
7" reel
13" reel
antistatic bag
Package Dimensions
Outline 63 (SOT-363/SC-70)
Recommended PCB Pad Layout for
Agilent's SC70 6L/SOT-363 Products
0.026
HE
E
e
D
A1
b
A2 _A
Q1
L
0.039
0.079
0.018
Dimensions in inches.
c
SYMBOL
E
D
HE
A
A2
A1
Q1
e
b
c
L
DIMENSIONS (mm)
MIN.
MAX.
1.15
1.35
1.80
2.25
1.80
2.40
0.80
1.10
0.80
1.00
0.00
0.10
0.10
0.40
0.650 BCS
0.15
0.30
0.10
0.20
0.10
0.30
NOTES:
1. All dimensions are in mm.
2. Dimensions are inclusive of plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to EIAJ SC70.
5. Die is facing up for mold and facing down for trim/form,
ie: reverse trim/form.
6. Package surface to be mirror finish.
6